工学 | SCI期刊专刊约稿信息6条

全文截稿: 2021-05-31

影响因子: 4.669

中科院JCR分区:

• 大类 : 工程技术 - 2区

• 小类 : 工程：工业 - 2区

• 小类 : 工程：制造 - 2区

• 小类 : 材料科学：综合 - 3区

网址：
https://www.journals.elsevier.com/journal-of-materials-processing-technology

Additive manufacturing (AM) processes for metals have begun transition from the laboratory to the factory and the level of commercial exploitation is rapidly increasing. However, the number of alloys at high technology readiness is limited. This can be attributed to a shortage of formulations specifically designed for AM alongside adaptation to processes which give rise to components with assured integrity. As machine architectures and capability are enhanced, the opportunity at the interface between materials science and process technology is a rich topic of research.

This special issue will attract state-of-the-art contributions from leading scholars in the realm of metal additive manufacturing. Drawing upon their experience across processes such as powder bed fusion, directed energy deposition, binder jetting and allied processes, papers will address topics which may include:


Alloy formulation for AM and its processability (Note that pure alloy formulation paper without assessment of its processability in AM does not fit with JMPT)

Alloying ‘in-process’

Novel processing characteristics to unlock material properties

Evaluation of integrity and functionality of new process-material interactions

Mechanisms and control of interface behavior in functional graded materials made by AM

全文截稿: 2021-07-01

影响因子: 2.924

中科院JCR分区:

• 大类 : 工程技术 - 3区

• 小类 : 工程：电子与电气 - 4区

• 小类 : 电信学 - 3区

网址：
https://www.journals.elsevier.com/aeu-international-journal-of-electronics-and-communications

The deployment of emergent communication systems, such as future satellite constellations for 5G applications or novel cellular based technologies for the development of autonomous vehicles, demands high-performance devices able to meet the technological requirements of next generation communication networks. Therefore, the development of novel RF and antenna devices for such applications is of great interest to the telecommunication industry. The main objective of this Special Issue is, therefore, to select original papers focused on solving the new challenges of the cited emergent communications systems, aiming at the design and fabrication of novel and high-performance RF and antenna components operating at microwave and millimeter-wave frequencies. New approaches and methodologies aimed at improving the design and performance of existing devices and techniques will also be welcome.